What are the advantages of choosing silicon nitride sheet as a packaging material?


Release time:

2021-11-17

The silicon nitride plate mainly uses the high thermal conductivity of the material to conduct heat and realize the heat exchange with the external environment. For power semiconductor devices, the package substrate must meet the following requirements:

1. High thermal conductivity. Currently, power semiconductor devices are packaged using thermoelectric separation, and most of the heat generated by the device is transferred through the package substrate. The substrate with good thermal conductivity can protect the chip from thermal damage.

2. The thermal expansion coefficient of the packaging material and the chip material match. The power device chip itself can withstand high temperatures, and changes in current, environment, and working conditions will change its temperature. Since the chip is directly mounted on the package substrate, the matching of the thermal expansion coefficient will reduce the thermal stress of the chip and improve the reliability of the device.

3. Good heat resistance, to meet the high temperature requirements of power devices, good thermal stability.

4. Good insulation, meet the requirements of electrical interconnection and equipment insulation.

5. High mechanical strength, to meet the strength requirements in the process of device processing, packaging and application.

6. Relatively appropriate price, suitable for mass production applications.

At present, commonly used electronic silicon nitride plates can be divided into polymer substrates, metal substrates (MCPCB) and ceramic substrates. For power device packaging, silicon nitride plate also requires high thermal conductivity, heat resistance, insulation, strength and thermal matching performance. Therefore, the use of polymer substrates such as PCBs and metal substrates such as MCPCBs is greatly limited.

Silicon nitride plate has high thermal conductivity, good heat resistance, high insulation, high strength and thermal matching with chip materials, so it is very suitable as a package substrate for power devices. At present, they have been widely used in semiconductor lighting, laser and optical communication, aerospace, automotive electronics, deep-sea drilling and other fields.

The emergence of silicon nitride sheet products has opened up the development of the thermal application industry. With the improvement of production technology and equipment, due to the heat dissipation characteristics of silicon nitride sheet and its high heat dissipation, low thermal resistance, long life, voltage resistance and other advantages, product prices are becoming more and more reasonable, thus expanding the application fields of the LED industry, such as Home appliance lights, car lights, street lights, outdoor large billboards, etc. The successful development of ceramic substrates will provide services for indoor lighting and outdoor lighting products, and make the market field of LED industry broader in the future.

In order to obtain better thermal conductivity, the LED chip is made of silicon nitride sheet. In addition, silicon nitride sheets are used as packaging materials for the following electronic equipment: high-power semiconductor modules; semiconductor refrigerators and electronic heaters; power control circuits, power hybrid circuits; smart power components; high-frequency switching power supplies, solid-state relays; automotive electronics, Aerospace, military electronic components. Solar panel components; telecommunications private branch exchanges, receiving systems; lasers and other industrial electronics.