What is a high thermal conductivity silicon nitride ceramic substrate


Release time:

2023-06-06

What is a high thermal conductivity silicon nitride ceramic substrate

High thermal conductivity silicon nitride ceramic substrate is a substrate material, made of silicon nitride ceramic processing, has the following characteristics:

1. High thermal conductivity. Silicon nitride ceramics have high thermal conductivity, usually 40-200W/mK, much higher than the general ceramic materials, similar to metal materials. This makes it well suited for use in electronic devices that require heat dissipation.

2. Excellent mechanical strength. Silicon nitride ceramics have high bending strength, tensile strength and compressive strength under static load, and can effectively carry and fix sensitive electronic components.

3. High arc resistance. Silicon nitride ceramics can quickly absorb and emit arc energy, and prevent the accumulation of charge on the surface, effectively inhibit arc breakdown, suitable for use in high-voltage environments.

4. Low dielectric constant and loss. Silicon nitride ceramic has a low dielectric constant and high-frequency loss, which can reduce the attenuation and interference of high-frequency signals and is suitable for high-speed and high-frequency circuit boards.

5. High insulation resistance. Silicon nitride ceramic has good electrical insulation, which can effectively insulate and support the components and circuits on the.

6. Excellent chemical stability. Silicon nitride ceramics have high acid and alkali resistance and oxidation resistance, and can be used for a long time in various harsh environments.

Therefore, the high thermal conductivity silicon nitride ceramic substrate is made by selecting a silicon nitride ceramic material with excellent thermal conductivity and mechanical properties, and is a multifunctional substrate material integrating thermal conductivity, high strength, arc resistance, low dielectric and high insulation.