High thermal conductivity silicon nitride ceramic substrate mainly has the following methods of use


Release time:

2023-06-26

High thermal conductivity silicon nitride ceramic substrate mainly has the following methods of use

High thermal conductivity silicon nitride ceramic substrate mainly has the following methods of use:

1. High-power semiconductor cooling. The high thermal conductivity silicon nitride ceramic substrate is used for the heat dissipation substrate of power semiconductor devices, such as IGBT, MOS tube, high power diode, etc. Its high thermal conductivity can effectively help these devices cool down and improve their reliability and service life.

2. Light source cooling. The high thermal conductivity silicon nitride ceramic substrate is used for the heat dissipation of various high-brightness light sources such as laser diodes, white LEDs, etc. Its high thermal conductivity effectively solves the large amount of heat generated by these light sources when they emit light, ensuring its luminous efficiency and service life.

3. Electronic components heat dissipation. The high thermal conductivity silicon nitride ceramic substrate is used for the heat dissipation substrate of electronic components such as CPU, power amplifier, microwave device, etc., which can effectively conduct and dissipate the heat generated during the operation of these components, and prevent overheating and damage to the components.

4. Precision instrument heat dissipation. High thermal conductivity silicon nitride ceramic substrate is used for heat dissipation of various precision instruments and precision machinery, such as lasers, accelerators, precision molds, etc. Its high thermal conductivity and high precision characteristics contribute to the temperature control and thermal stability of these precision equipment.

5. New energy heat dissipation. The high thermal conductivity silicon nitride ceramic substrate is used for the heat dissipation of new energy sources such as fuel cells and solar panels, and its high thermal conductivity contributes to the loss of a large amount of waste heat generated during the conversion and storage of new energy sources, thus improving the efficiency of the system.

Because of its high thermal conductivity, low thermal expansion coefficient and high mechanical strength, high thermal conductivity silicon nitride ceramic substrate has been widely used in the thermal management of electronics, optoelectronics, precision machinery and other industries, which is conducive to the efficient and stable operation of devices and systems. Relevant enterprises should continuously improve product performance and manufacturing process. Develop differentiated new products to meet diverse needs. Strengthen marketing promotion and expand the international market. Closely follow technological changes, launch high value-added products, and ensure technological and market competitiveness. At the same time of industrial expansion, we should pay more attention to cost control and resource optimization to improve industrial efficiency. In addition to policy support, it is also necessary to strengthen exchanges with upstream and downstream and the same industry, promote industrial standardization and collaborative innovation, and create a good environment for industrial development.