High thermal conductivity silicon nitride ceramic substrate has the following advantages:


Release time:

2023-09-06

High thermal conductivity silicon nitride ceramic substrate has the following advantages:

High thermal conductivity silicon nitride ceramic substrate has the following advantages:

1. Good thermal conductivity and high thermal conductivity. Conducive to heat dissipation of electronic devices and improve stability.

2. High mechanical strength, high hardness and good wear resistance.

3. Good high temperature resistance, wide working temperature range, up to 1000-1400°C.

4. High thermal shock stability and strong thermal shock resistance.

5. Large insulation resistance, high voltage resistance, suitable for electrical performance requirements of electronic devices.

6. Good sealing, no infiltration of copper, silver and other metals, the interface is firm.

7. Non-toxic, tasteless, no pollution, long service life.

8. Wide source of raw materials, low cost. The process is simple and mass production is easy to achieve.

9. Can be made into a large size substrate to meet the needs of high-power devices.

10. It has good matching with chips and is an excellent substrate material for integrated circuits.